Lapping/Polishing CArriers
In stock
Reconfirm the price with seller
- Customer pickup,
- Courier
- In detail
Products of other enterprises
Description
For the purpose of manufacturing high quality semiconductor wafer, the sliced wafer from a silicon ingot requires surface flatness by specular finish and highly uniform thickness. The wafer production processes of ensuring such precision surface flatness and planarization are called lapping and polishing processes.
With the features below, our unique lapping/polishing carriers enable the production of ideal silicon wafers of various sizes: 100, 125, 150, 200 and 300 millimeters.
Contact the seller
Lapping/Polishing CArriers
We recommend to see